PCB and manufacturing method thereof

The embodiment of the invention discloses a PCB and a manufacturing method thereof, which relate to the field of electrical (electronic) elements for solving the problem of large wiring complexity by adopting a ground wire to isolate interference. The PCB provided by the embodiment of the invention comprises a substrate and N anti-interference wiring units, wherein the N anti-interference wiring units are arranged on one wiring surface of the substrate; N is larger than or equal to 1; each anti-interference wiring unit comprises a wiring layer, an insulated layer and a shielding layer, the wiring layer comprises at least one signal wire, each signal wire is divided into an end part and a main body part, the insulated layer at least coats the main body part of each signal wire in the wiring layer, the shielding layer coats the insulated layer, and in the vertical line direction of the substrate, the shielding layer does not coincide with the end part of each signal wire on the wiring layer.