Circuit board and manufacturing mehtod thereof

A circuit board is disclosed. A circuit board, upon the upper surface thereof and having a first via hole penetrating through the first metal layer; Wherein the plating part is provided on one surface of the via hole; An insulating film provided on the surface of the plating unit; Reduced Wars sebum may include, but further increasing the thickness of the first metal layer than the prior art, so that miniaturization of the first via is possible; and a first via formed is a conductive material provided on at least a portion of the region surrounded by the outer surface of the insulating film and it is advantageous in heat radiation performance improvement.