Surface treatment roughening process for electronic copper foils

The invention belongs to the technical field of surface treatment production of copper foils, in particular relates to a surface treatment roughening process for electronic copper foils. The surface treatment roughening process comprises the following steps: cathode copper and concentrated sulfuric acid are mixed for dissolving to prepare roughening solution, wherein Cu2+ is 20-40 g/L, H2SO4 is 80-150 g/L, and the temperature of the roughening solution is 25-40 DEG C; and after being fully mixed, the obtained roughening solution is fed in a roughening groove, and is electroplated by high-current density, medium-current density and low-current density in sequence. The roughening process uses one electroplating solution to replace the roughening solution and curing solution with different components, realizes electrolytic copper foils with high specific surface area, low peak value and high binding force through controlling different current densities, and has excellent stripping strength when being applied to plates of Tg 170 and above.