Laser micro-machining of LPM compound material for panel and IC packaging

In this paper, the authors present a study of micromachining of LPM (low pressure mold) material by using ultrafast laser including cutting, drilling and trenching. LPM is a rubber like material and the processing speed is usually slow. We did some tuning of process parameters to improve the machining speed by the ultraviolet laser. The test results will be presented as the effective speed is improved from 0.8 mm/min to 2.99 mm/min; hole diameter: top 2.63 mm, bottom 2.57 mm; cutting wall side tilt ∼1 degree. A series of comprehensive parametric study has been conducted in this paper.