PPF(pre-plated frame) technology using Sn-Bi and pure Sn electro deposition on alloy 42 lead frame for semiconductor package corresponding to lead-free movement

There are many lead-free finish options such as pure Sn, Sn-Ag, Sn-Bi and Sn-Cu post-mold plating and Pd pre-plating for the lead frame plating in semiconductor package. In the present work, Sn-Bi and pure Sn pre-plating technology for alloy 42 lead frame have been performed. The electrodeposition was done by two-tone selective plating method. Ag was plated on external lead, respectively. Surface and cross-sectional morphology were observed by SEM, and solderability/bending crack/whisker performance after temperature cycles have been performed.