Ultrasoft and High Magnetic Moment NiFe Film Electrodeposited From a Cu $^2+$ Contained Solution

We report a methodology to fabricate ultrasoft NiFe films via electrodeposition in a sulfate solution. With a little addition of Cu 2+ into the solution, NiFe films become extremely soft: typically, the film coercivities in the hard and easy axes are 0.03 and 0.15 Oe, respectively. The maximum relative permeability is also significantly increased to the order of 1times10 4 . Meanwhile, these achieved ultrasoft NiFe films show a small but finite anisotropic field and high magnetic moments ranging from 1.1 to 1.65 T. These kinds of films can be potentially applied in current and future magnetic recording systems as well as biotechnological and microelectronic devices