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Thermally enhanced GaN hybrid‐IC power amplifier using embedded IC process in a copper sheet
Thermally enhanced GaN hybrid‐IC power amplifier using embedded IC process in a copper sheet
2018
Tae‐Woong Yoon
Dongsu Kim
Jong-Min Yook
Keywords:
Amplifier
Electronic engineering
Copper
Mathematics
high power amplifier
Optoelectronics
Correction
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