Chip-level system sensor and preparation method thereof

The invention relates to the technical field of sensors, and in particular relates to a novel chip-level system sensor (SOS, System On Sensor) and a preparation method thereof. The novel chip-level system sensor comprises a sensing component, an MEMS (Micro-Electro Mechanical System) sensing platform and an ASIC (Application Specific Integrated Circuit) integrated circuit, wherein the sensing component is used for acquiring parameters required by measurement; the MEMS sensing platform is used for controlling the sensing component to acquire signals and convert the acquired signals into electrical signals; and the ASIC integrated circuit is used for controlling the MEMS sensing platform to acquire the signals and perform data operation, analysis, control and output of the acquired signals. The ASIC integrated circuit, the MEMS sensing platform and the sensing component are integrally formed on a silicon wafer through a single-chip integrated process; the ASIC integrated circuit, the MEMS sensing platform and the sensing component are configured together through a stereo circuit interconnection structure; sensing, analysis, control and communication functions can be integrated in the chip-level sensor, the volume of which is very small; the self system-level closed loop is realized; the problems of non-steady signal and low reliability and precision due to the traditional peripheral circuit can be solved; the performances of sensor products are improved comprehensively; and the chip-level system sensor is particularly applied to being installed on terminal products, which are high in precision, low in power consumption, ultra-small in volume and intelligent.