Joint Properties and Thermomechanical Reliability of Nanoparticle-Added Sn-Ag-Cu Solder Paste

Joint properties of a La2O3-nanoparticle-added Sn-3.0wt%Ag-0.5wt%Cu (SAC305) solder were investigated in this study. Nano-composite solders which contain second-phase nanoparticles in the solder matrix are known to possess high mechanical strength and creep resistance. In this study, La2O3 nanoparticles were mixed with a Sn-Ag-Cu solder paste and the solder joint properties as well as the process ability was evaluated in this study. The slump properties of the nano-composite solder paste was similar to that of the conventional solder paste. The La2O3-added SAC305 nano-composite solder paste had higher spread area than conventional SAC305 solders. The nanocomposite solder paste had higher toughness than the conventional solder paste. The La2O3 -- added SAC305 solder paste also showed excellent thermal shock resistance compared with the conventional SAC305 solder.