Alignment mark for coarse adjustment and fine adjustment of a semiconductor wafer in an exposure apparatus

The invention relates to an alignment mark for coarse adjustment and fine adjustment of a semiconductor wafer in an exposure apparatus. The alignment mark comprises a first partial structure (10) for generating a first reflection pattern in the exposure apparatus for fine adjustment of the semiconductor wafer having a plurality of first structure elements (12), wherein the first structural elements (12) is substantially parallel to and at a predetermined center distance next to each other to symmetrically the center of an inner portion (14) are arranged. The alignment mark comprises a second part structure (16) for generating a second reflection pattern in the exposure apparatus for rough adjustment of the semiconductor wafer having a plurality of second structural elements (18), wherein the second structural elements (18) of the second part structure (16) according to a stored in the exposure apparatus, the pattern are formed and arranged in the inner region (14).