Compact circuit modeling을 이용한 via stitched(VS)-Electromagnetic Bandgap (EBG)의 Parameter 분석

The compact circuit model for the via-stitched(VS) electromagnetic bandgap(EBG) is developed in this paper. Although the full wave electromagnetic (EM) simulation can provide accurate and complete solutions, however, this approach becomes very lengthy and memory intensive as the physical size of the structure increases. On the other hand, once the compact circuit model for the structure is developed then the structure and effects of parameters can be analyzed without spending intensive time. In addition to this time efficiency, this approach gives ideas to minimize the size of EBG structure.