Undercoat-forming resin composition, laminate, pattern-forming method, imprint-forming kit, and device-manufacturing method

The purpose of the present invention is to provide: an undercoat-forming resin composition, the thickness of the residual film after mold-pressing being small and for which variation in line width distribution after processing does not occur easily; a laminate; a pattern-forming method; an imprint-forming kit; and a device-manufacturing method. Provided is an undercoat-forming resin composition used for the substrate to form an undercoat, wherein the composition contains: a first resin with a radical-reactive group on a side chain; a second resin with a fluorine atom and/or a silicon atom; and a solvent. Preferably the second resin is a fluorine atom-containing resin. Preferably, the radical-reactive group of the first resin is a (meth)acryloyl group.