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A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
2021
Jeong-Won Yoon
Dong-Hwan Lee
Byung-Suk Lee
Keywords:
Solder paste
Shear strength
Intermetallic
liquid phase
Transient (oscillation)
Materials science
Composite material
Correction
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