Old Web
English
Sign In
Acemap
>
Paper
>
Non-destructive confirmation method of bonding situation for III-V/Si hybrid partial direct bonding
Non-destructive confirmation method of bonding situation for III-V/Si hybrid partial direct bonding
2018
Liu Bai
Takehiko Kikuchi
Junichi Suzuki
Kumi Nagasaka
Nobuhiko Nishiyama
Hideki Yagi
Tomohiro Amemiya
Shigehisa Arai
Keywords:
Photochemistry
Direct bonding
Chemistry
Physical chemistry
Materials science
non destructive
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]