Modelling and numerical computation of the effective thermal conductivity of particulate filled polymers

Thermal management of plastic packages of active electronic devices asks for highly thermal conductive molding compounds to decrease heat resistance of the polymer. Modelling and computation of the effective thermal conductivity λ eff of epoxy resins containing ceramic or metallic particles is presented. This model allows to predict λ eff by a numerical solution of heat transfer in a cluster for high volume loadings C > 60%.