Thermal management for high performance integrated circuits with non-uniform chip power considerations

Thermal management for nonuniform chip power integrated circuits is studied. Circuit chip power analysis was used to generate nonuniform chip power and computational fluid dynamics (CFD) techniques are used to calculate the chip temperature. This paper also presents an integrated thermomechanical analysis of a ceramic ball grid array (CBGA) single chip module (SCM) system under chip power loads. A three-dimensional finite element model (FEM) was used for the sequential heat transfer and mechanical analyses to predict the temperature gradients and associated structural response of stress and deformation of the SCM. The thermomechanical analysis results are used to examine the integral effect of chip power loading conditions and of two design parameters, the substrate and cap materials, on the structural integrity of the modeled CBGA SCM system.