WInSiC4AP: Wide Band Gap Innovative SiC for Advanced Power

The use of SiC technology to face the automotive challenges in the coming years is among the objectives pursued in the ECSEL JU project WInSiC4AP. The project is supported with a synergy between ECSEL JU and ESI financing that will enable complementary activities with significant economic and social impact. The Project led by DTSMNS (Distretto Tecnologico Sicilia Micro e Nano Sistemi) started on June 2017 for a duration of 36 months on research, technology, package and applications. This paper will address the main activities in 2nd year of project for automotive with a focus on innovations in SiC technology and the power module packaging.