Thermo-setting double-sided adhesive film excellent in adhesive property and heat resistance

The present invention relates to an adhesive film used in the laminate CSP (chip scale package), more particularly, to prevent adhesion and electrical interference between the die to be laminated and wire (wire) during hot-working as a double-sided adhesive film which serves as a space for securing is capable of preventing defects such as cracking popcorn phenomenon or interfacial separation of the package due to a strong water vapor pressure of the water that is moisture-absorbing heat resistance and adhesion to the package interior relates to an excellent thermosetting double-faced adhesive film. For this purpose, a the invention the adhesive film between heat resistance and adhesive strength is excellent thermosetting double-faced adhesive film is an adhesive layer coated on both surfaces of a polyimide film die (Die) in accordance with, the adhesive layer is NBR carboxyl groups comprises 1 to 10% by weight 100 parts by weight compared to epoxy resin, 5 to 200 parts by weight of phenol resin 50 to 200 parts by weight of an amine-based or acid anhydride-based curing agent 2 to 40 selected at least one curing agent of the parts by weight of dicumyl peroxide, and containing 1 to 5 parts by weight the phenolic resin is characterized by a softening point measured by the ring method ball end (ring and ball method) of 60 ~ 120 ℃.