Thermal management system with different configuration liquid vapor chambers for high power electronic devices

Abstract The thermal performance of the vapor chamber with different configuration structures for high power electronics is investigated experimentally. An experimental system is designed and constructed to test the vapor chambers. The seven vapor chambers with different configuration structures divided into 4 groups which consist of (1) copper and aluminum as fins, (2) channel width of the heat sink (1.2 mm and 2.0 mm), (3) with and without mini-channel at the evaporator, and (4) diameter/number of the wick column structures, are investigated. The monitored parameter mainly focuses on the thermal resistance of the vapor chamber with the relevant parameters. To achieve the appropriate thermal performance of the vapor chamber, it depends on the operating conditions and configuration structures such as coolant mass flow rate, heat source size, and heat rate. Besides, the vapor chambers constructed the mini-channel at the evaporator area, using the high thermal conductivity material with smaller channel width as a heat sink. The most important parameter is the sintering structure, which has a small diameter, and more wick columns have a significant effect on the capillary effect augmentation and the thermal performance enhancement of the vapor chamber.