Research and development of new generation High Voltage Flip Chip LED

This paper presents the development and performance of a new generation of Direct Attach middle power 6V High Voltage Flip Chip (HVFC) LED designed to be directly attached using AuSn or SnAgCu solder by surface mount technology (SMT). Comparison is made against a standard 3V Flip Chip (FC) LED of equal chip dimension (780um × 380um). At 0.5W operation, both HVFC and FC have comparable Wall Plug Efficiency of 37% and Luminous Efficacy of 120lm/W at 6500K CCT, 70 CRI.