Heat-sensitive film adhesive

PURPOSE: The titled adhesive, suitable for bonding a (non)woven fabric, foam, wood, metal, paper, etc. having improved low-temperature adhesive property, heat resistance and hot tackiness, and prepared by incorporating a specific ion crosslinked copolymer and a polyamide resin in specified proportion. CONSTITUTION: An adhesive comprising (A) 95W20pts.wt. ion crosslinked copolymer containing ehtylene as a copolymer consistutent, preferably ethylene-α,β-ethylenically unsaturated carvoxylic acid copolymer with an ethylene content ≥85mol%, preferably corsslinked with a metallic ion, and (B) 5W80pts.wt. polyamide resin, e.g. nylon-6, having a melting point ≤160°C, preferably 120W80°C. (C) A low- molecular weight polyethylene or halogenated paraffin wax is incorporated if necessary in an amount of 5W100pts.wt. per 100pts.wt. the total amount of the components (A) and (B). The melt index (MI) ratio of the components (A) to (B) is preferably in the range of the formula. COPYRIGHT: (C)1981,JPO&Japio