Stamping device of electronic element

Disclosed is a stamping device of an electronic element, comprising an upper die (1) and a lower die (2), wherein the upper die and the lower die are respectively provided with an elastic component (5, 7), a material inlet opening (3, 4) and a balancing valve (11, 12, 13). In the device, by means of adding an elastic component inside a stamping clamp and filling with air or other materials without fixed shapes to stamp an element, the usability of the stamping clamp is improved, the stamping efficiency is high, and the stamping effect is good.