Мезомеханика поведения тонких пленок Cu на подложке при одноосном растяжении и термическом отжиге. Многоуровневый подход

Using a scanning tunneling, atomic-force and scanning electron microscopy we have studied the character of plastic deformation and fracture of thin Cu films on the silicon and polypropylene substrates during thermal annealing and in uniaxial tension. Mechanical characteristics of initial films are determined by the nanoindentation technique. It is shown that on the surface of Cu films in uniaxial tension a mesostructure in the form of interlacing mesobands is generated, while during thermal annealing a cellular mesostructure is formed. Geometric parameters of the surface mesostructure are found to depend linearly on the film thickness. The obtained results agree well with the concept of a "chessboard" stress distribution in the vicinity of the "film substrate" interface in a multilevel model of a deformed solid.