3D-integrated, low-height, small module design techniques for 4.48GHz, 560MHz-bandwidth TransferJet™ transceiver

A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8mm × 1.0mm. Since RF signals are degraded by parasitic capacitance associated with the low height and small footprint of the module, three design techniques are proposed in the paper. The module realizes the world's smallest size, and achieves sufficient transmitter modulation accuracy and receiver sensitivity, which meet TransferJet™ standards.