On Micro Forming by Hydro Spark Forming Method

This paper proposes a seamless microforming technique from 100 micrometer order bulging all the way down to micrometer-order embossments by using hydro spark forming method. Sub-millimeter order bulging with 300 and 100 m diameter aluminum thin foils are demonstrated to be easily available without accurate positioning as in the conventional methods. The present technique is successfully applicable also to surface embossments of micrometer order, for a coin surface, an IC chip and hologram surfaces.