Semiconductor packages and methods for fabricating the same

The present invention relates to a semiconductor package and a manufacturing method thereof, and mounted on the package substrate is provided on the semiconductor chip, the package substrate having If the opposite side of the top surface that faces the package substrate for molding the semiconductor chip, the mold layer, and a heat radiation film is provided on the upper surface of the semiconductor chip. The molded film has a top surface forming an upper surface coplanar with the semiconductor chip. The surface roughness having a top surface of the semiconductor chip is different from the surface roughness of the mold having the film top surface.