A semiconductor device comprising a chip carrier having openings for contacting

Disclosed is a semiconductor component comprising at least one semiconductor chip (2), a chip carrier (1) for mounting the semiconductor chip (2) onto a first surface (8) of the chip carrier (2) and contact points (6) which are electrically connected to the semiconductor chip (2) and which are provided with a conductive connection via openings (20) of the chip carrier (1) to solder terminals (5) in the area of a second surface (9) of the chip carrier (1). The solder terminals (5) are formed from a metal film (7) which lines the openings (20), extends from the first surface (8) through the openings (20) to the second surface (9) and can be directly contacted. The semiconductor component also comprises an opening (10) in the chip carrier below the semiconductor chip (2). A metal film (11) which lines said opening (10) is situated between the chip carrier (1) and the semiconductor chip (2) so as to form a solder terminal.