Non-uv type die attach film and method for manufacturing the same

PURPOSE: A non-UV type die attach film is provided to lower an adhesion between a dicing film layer and an adhesive layer to strippability required for chip picup while maintaining the adhesion of the edge portion of the dicing film layer. CONSTITUTION: A method for manufacturing a die attach film comprises the steps of: introducing an adhesive layer(120) and a dicing film layer(110) of a photo-curable adhesive including an adhesive layer portion(113) and a ring frame portion(114); and irradiating ultraviolet ray to a back side of the dicing film layer and inducing the inflow of oxygen as a radical scavenger to an upper side of the exposed ring frame portion to suppress the photo-curing of the ring frame portion, and inducing the photo-curing of the adhesive layer portion in which the inflow of the oxygen is blocked by the adhesive layer.