Electrically conductive adhesive film, and dicing/die-bonding film using same

The purpose of the present invention is to provide: an electrically conductive adhesive film which is suitably used as an electrically conductive bonding material when bonding a semiconductor chip (particularly a power device) to the top of an element carrying part of a lead frame or to the top of a circuit electrode part of an insulating substrate, and is capable of forming, between the semiconductor chip and the top of the element carrying part of the lead frame or the circuit electrode part of the insulating substrate, a bonding layer which exhibits particularly excellent electrical conductivity while being lead free, and both excellent mounting reliability and heat resistance after bonding and sintering; and a dicing/die-bonding film using said electrically conductive adhesive film. This electrically conductive adhesive film includes metal particles (Q), a resin (M), and a prescribed organic phosphorus compound (A). The resin (M) includes a thermosetting resin (M1). The metal particles (Q) include at least 10 mass% of first metal particles (Q1) which have an average particle size (d50) of not more than 20 µm, and which have a fractal dimension when viewed in a projection view in a primary particle state of at least 1.1.