Laser processing device of a silicon-glass bonding slice

The utility model relates to a laser processing device of a silicon-glass bonding slice. An optical shutter, a beam expanding lens and an aperture diaphragm are arranged on an output end of an ultravoilet high-frequency ultrashort pulse laser, a pair of 45 DEG holophotes are arranged on the output end of the aperture diaphragm, a deflection lens is arranged on the output end of the 45 DEG holophote, the 45 DEG holophote is arranged on the output end of the deflection lens, a condensing lens is arranged on the output end of the 45 DEG holophote and over against a three-dimensional movable platform, a CCD lighting lamp is mounted below the condensing lens, a coaxial CCD para-position observation system is arranged above the three-dimensional movable platform. The light beam emitted from the ultravoilet high-frequency ultrashort pulse laser is optically focused on an upper surface of a glass material to be processed, the width of the one-time cut path is controlled by the spiral deflection lens, the proper width of the cut path is adjusted, the cut path can be accurately positioned and cut, the focus point is controlled to correspondingly drop together with the increase in the cutting depth and the each cut path on the silicon-glass bonding slice is cut in turn.