Semiconductor packaging part and manufacturing method therefor

The invention provides a semiconductor packaging part and a manufacturing method therefor. The semiconductor packaging part comprises a substrate, a dielectric layer, a rewiring structure, a semiconductor chip, and an encapsulating layer, wherein the substrate comprises a first surface, a second surface back to the first surface, and conductive columns which extend in the substrate to connect the first surface and the second surface; the dielectric layer is positioned on the first surface of the substrate; the rewiring structure is arranged in the dielectric layer and electrically connected to the conductive columns; the semiconductor chip is arranged on the dielectric layer and electrically connected to the rewiring structure; and the encapsulating layer is positioned on the dielectric layer and encapsulates the semiconductor chip, wherein each of the substrate and the encapsulating layer is formed by a moulding material.