Flip LED package member

The invention provides a flip LED package member. The flip LED package member comprises a substrate, a flip LED chip, conducting layers and a silica gel layer; a first electrode groove and a second electrode groove are formed in the substrate; a barrier part is formed between the first electrode groove and the second electrode groove; the conducting layer is arranged in each of the first electrode groove and the second electrode groove; two electrodes of the flip LED chip are correspondingly arranged in the first electrode groove and the second electrode groove respectively; the silica gel layer is arranged on the surface of the flip LED chip. According to the flip LED package member adopting the technical scheme, the first electrode groove and the second electrode groove are tactfully formed in the substrate, so that the flip LED chip can be accurately and conveniently arranged on the substrate; meanwhile, the flip LED chip is fixed through the conducting layers, the connection between the flip LED chip and the substrate can be simpler, and finally the package of the flip LED chip is realized through the silica gel layer.