Halogen-free high frequency resin composition

The invention discloses a halogen-free high frequency resin composition. The halogen-free high frequency resin composition comprises, by weight, 20-50 parts of a dicyclopentadiene type epoxy resin, 10-40 parts of a styrene-maleic anhydride copolymer, 10-30 parts of a benzooxazine resin, 5-20 parts of a multifunctional epoxy resin and 20-40 parts of at least one phosphorus-containing fire retardant. A copper-clad plate made by using the halogen-free high frequency resin composition has the characteristics of low dielectric constant, low dielectric loss, high heat resistance, low hygroscopic coefficient, low expansion coefficient, good PCB processability and the like.