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The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers
The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers
2005
Yan Jiuchun
Xu Zhiwu
Wu Gaohui
Yang Shiqin
Keywords:
Composite material
Polymer
Microstructure
Metallurgy
Materials science
Solid mechanics
Correction
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