The evolution of organic solderability preservatives (OSP) from a temporary protectant to a leadership position in surface finishing chemistry

Purpose – The purpose of this paper is to present an overview of the evolution of organic solderability preservatives (OSP) technology from a temporary anti‐tarnish to an approved process for the lead‐free assembly of high‐reliability printed circuit boards (PCBs).Design/methodology/approach – As this is an informational paper, the main approach was to compare and contrast various types of OSP molecules and their fitness for use.Findings – The active ingredient of an OSP is one of the most important ingredients that can help to improve the heat resistance, which becomes much more important in conjunction with lead‐free solder. The latest OSP shows excellent stability, even at more than the peak reflow temperatures used with lead‐free solders. The success of any OSP process is highly correlated to process control and maintenance and OSP formulations are not created equal. The thickness of the film is only one difference. However, the key differentiators for OSP coatings are the overall ability of the organ...