Microfluidic-channel heat dissipation device used for an electronic component and electronic device

The utility model discloses a microfluidic-channel heat dissipation device used for an electronic component and an electronic device. The microfluidic-channel heat dissipation device comprises a shell of which one side is provided with a cavity, and a cover plate which is provided with a liquid inlet and a liquid outlet which are communicated with the cavity. The bottom wall of the cavity is provided with microfluidic channels; the microfluidic channels comprise a plurality of longitudinal microfluidic channels which are parallel to each other and a plurality of horizontal microfluidic channels which are parallel to each other; and the longitudinal microfluidic channels and the horizontal microfluidic channels intersect with each other so as to form a channel array through which a cooling fluid can flow. The electronic component is welded or bonded on the surface of the microfluidic-channel heat dissipation device of the utility model; the electronic component, a micro pump, the microfluidic-channel heat dissipation device and a fin heat exchanger are connected with one another through conduits so as to form a sealed forced circulation path. Based on a cooling working medium inside the microfluidic channels, through a forced convection mode, the dissipation of heat of the surface of a high-power density electronic component can be realized. The utility model also discloses the electronic device provided with the microfluidic-channel heat dissipation device.