The method of printed wiring board substrate with the substrate, manufacturing a printed wiring board and a printed wiring board

The present invention provides a printed wiring board types, comprising: a base film having an insulating property; containing metal particles by coating conductive ink so that the first conductive layer is laminated on a surface of at least one of the base film; and by plating clad laminate whereby the conductive layer on said first base film and the second conductive layer on the opposite surface side. In the region adjacent to the interface between the base film and the second conductive layer, the presence of metal oxide derived from metal hydroxides of the metal particles and the metal of the metal particles originating from a metal, and the metal oxide of the adjacent area of ​​the interface between the base film and the second conductive layer having 0.1μg / cm to 10μg / cm, mass per unit area, and the metal oxide species and the mass ratio of metal hydroxide species is 0.1 or more.