Power Semi-Conductor package and Method of Manufacturing for the same

The power semiconductor package, the base substrate is at least one or more of the first semiconductor element is mounted is formed in accordance with one embodiment of the present invention; The first is formed on the upper surface of the semiconductor element, a lead frame is that the solder paste injected into the injection port formed thereon; And it is interposed between the first semiconductor element and the lead frame including a space that forms the separating space, and provides a semiconductor module package that has solder paste filled inside the spaced space.