In Situ Synthesis of 3D Interconnected Graphene-Reinforced Copper Composites

Graphene shows great potential in composite applications, but the performance of traditional graphene-metal composites is poorer than desired due to the uneven dispersion of graphene in the matrix. This study provides an effective method to grow high-quality graphene on the surface of 3D porous copper using a combination of chemical vapor deposition and spark plasma sintering to obtain a dense 3D-interconnected graphene/Cu composite. Transmission electron microscopy and scanning electron microscopy showed that graphene-coated copper and Raman analysis showed high-quality graphene. The tensile strength of the 3D graphene/Cu composite was 425 MPa, which is ~ 25% higher than that of pure Cu, and the coefficient of friction (0.33) is about 45% lower than that of pure Cu (0.58). The formation of high-quality 3D graphene interconnects in the Cu matrix results in a higher mechanical strength, better friction properties and superior electrical and thermal conductivity of the composite compared to those of pure Cu.