Characterisation and reliability evaluation of a verticle multichip module (NCM-TV) technique using test chips

A test chip designed for characterisation. and reliability evaluation of a 3-dimensional vertical multichip module (MCM-V) technique and it's application in ESPRIT Project TRIMOD - TRI-dimensional multichip MODules will be described. The design of the test chip itself, of technology demonstrator (TD) modules incorporating the test chips and the results of thermal, thermomechanical and electrical characterisation and reliability testing will be presented. In addition, the correlation between thermal and thermomechanical modelling and measured results from the TD modules will be discussed.