Packaging method for realizing separation of fluorescent powder glue away from coating in light emitting diode (LED) package and application

The invention belongs to the light emitting diode (LED) packaging technology, and relates to a packaging method for realizing separation of fluorescent powder glue away from coating in LED package and an application of the method. The method is characterized in that: fluorescent powder glue is filled inside a gap between a primary lens and a secondary lens in the LED package, the thickness of the fluorescent powder glue is adjusted according to the size of the gap between the primary lens and the secondary lens to realize the uniform or nonuniform thickness. The primary lens can be semispherical or rectangular, or can be a free curved surface with internal top being a plane; and the outer surface of the secondary lens can be a free curved surface, and the inner surface of the secondary lens can be a semispherical shape, a rectangular shape, a trapezoid shape or other shapes with the top part being a plane. The packaging method can be used for controlling the geometric shape of the fluorescent powder layer in the LED package. Due to the adoption of the packaging method, the fluorescent powder glue can be away from the coating, and at the same time, the LED can satisfy the optical requirements such as brightness uniformity, high light emission efficiency, and uniformity of color temperature control and color control.