Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations

This paper presents a study on multiphysics softwares reliability provided by COMSOL and ANSYS. The goal is to give an overview about the fundementals of how to set up RF simulations, mechanical contact and residual stress through three examples choosen as the main keypoints in order to make in the future an highly coupled model of the RF Mems switches packaging.