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Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating
Interface Structure of Cu Wire Bonding on Cu Substrate with Sn Plating
2014
Shinichi Fujiwara
Reinhold H. Dauskardt
Keywords:
Metallurgy
Intermetallic
Substrate (chemistry)
Wire bonding
Materials science
Chemical engineering
ultrasonic bonding
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