Device and manufacturing method

The present invention discloses a device and a method of manufacturing, the apparatus comprising: a first chip having a first side and a second side opposed thereto, the first side having a first region and a second region, and a metallic first bump is formed on the first region of the first chip having a first planar dimension. A second chip bonded to the first chip through a first side of the first metal bump. A first dielectric layer located on a first side of the die located directly above and includes a first portion on the second chip, a second opening surrounding a portion of the first and second chip regions are exposed to the second chip. A second region of a second metal bump is formed on the first chip and extend into the inner opening of the dielectric layer, a second plane having a plane size larger than the first dimension. And an electronic component bonded to the first side of the first chip through the second metal bump. The present invention increases the flexibility of the chip stack.