The conductive paste and the circuit board, and the circuit article and manufacturing method thereof

The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 mum or more and 10 mum or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board (1') is provided with a substrate (11) and an electrode (12) formed at least on one side of the substrate (11) using the above conductive paste. On the surface of the electrode (12), an adhesive insulating area composed of a composition having a storage modulus at 25° C. smaller than that of the resin constituting the conductive paste may be provided.