Semiconductor module, the semiconductor device with the semiconductor module and method for manufacturing the semiconductor module

A semiconductor module is configured so that heat radiation (12-15) are connected to lead frame (9-11) and semiconductor chips (7a, 7b, 8a, 8b) directly to the lead frames (9-11) are connected, so that the semiconductor chip ( 7a, 7b, 8a, 8b) do not have conductive portions (12a-15a) are connected to the heat radiation (12-15) to the lead frames (9-11). Therefore, the conductive portions (12a-15a) may have a one-piece mold without being divided. Thus, the occurrence of a curvature of the heat radiation (12-15) is suppressed when a temperature of a high temperature to room temperature after the resin mold at a high temperature or the like is reduced. Therefore, a connection between the semiconductor chip (7a, 7b) and the lead frame (9-11) and a connection between the lead frame (9-11) and the Warmeabstrahlsubstraten (12-15) improved.