Method of manufacturing multilayer circuit board

The invention discloses a manufacturing method of a multilayer circuit board. The manufacturing method comprises the steps of: providing a first copper-clad plate provided with a forming area and an edge area surrounding the forming area; etching the edge area of the first copper-clad plate to form at least one concentric copper ring group, wherein the concentric copper ring group comprises a first copper ring and a second copper ring surrounding the first copper ring, the center of a circle of the first copper ring is defined as the initial center; providing a second copper-clad plate and a bonding layer, and hot-pressing the bonding layer between the first copper-clad plate and the second copper-clad plate so as to form a multi-layer base plate; taking the initial center as the center of a circle, and manufacturing a detecting hole penetrating the first copper-clad plate, the bonding layer and the second copper-clad plate; irradiating the multi-layer base plate with light so as to obtain the relative position relationship between the detecting hole and the concentric copper ring group to determine the error of offset between the detecting hole and the initial center; and according to the error of offset, determining the expansion/shrinkage ratio of the hot-pressed multilayer base plate, and determining the position of a via hole arranged on the multilayer base plate according to the expansion/shrinkage ratio.