in which this is used semiconductor element heat dissipating member, semiconductor device and process for its preparation
2003
A semiconductor element heat dissipating element a conductive substrate and comprises an electrically insulating amorphous carbon film comprising hydrogen, wherein the electrically insulating amorphous carbon film is provided on at least a portion of the conductive substrate on which a semiconductor element is to be provided.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI