A mechanical screening method for glass passivated wafers

The paper presents a method for the improvement of product reliability based on screening at the wafer fabrication stage, which is time and money saving for manufacturer. It relates to the manufacture of automotive rectifier diodes in DO21 case. The aim was to establish a mechanical screening procedure based on the correlation between the resistance to applied pressure of glass passivated chips and the results of standard reliability RTV test (rapid thermal variations).