Paste for bonding components of electronic power modules, system and method for applying the paste

The invention relates to a paste, preferably for the connection of components of electronic power modules, wherein the paste comprises a solder powder, a metal powder and a binder, wherein the binder solder powder and metal powder binds in front of a first heating. According to the invention the binder of flux or a flux with a low activation only is on. In this manner, a bonding layer may be provided between a first and second component, which has only small inclusions cavity and a good mechanical and electrical stability.